Kirk here with more TSMC news:
— start quote — One option the chipmaking giant is considering is bringing its chip-on-wafer-on-substrate (CoWoS) packaging technology to Japan, according to one of the sources who was briefed on the matter. CoWoS is a high-precision technology that involves stacking chips on top of each other, boosting processing power while saving space and reducing power consumption. Currently, all of TSMC’s CoWoS capacity is in Taiwan. — end quote —
