Kirk here with more TSMC news:

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One option the chipmaking giant is considering is bringing its chip-on-wafer-on-substrate (CoWoS) packaging technology to Japan, according to one of the sources who was briefed on the matter.
CoWoS is a high-precision technology that involves stacking chips on top of each other, boosting processing power while saving space and reducing power consumption.
Currently, all of TSMC's CoWoS capacity is in Taiwan.
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